Publications

Peer-reviewed Journal Publications

  1. Cuddalorepatta G. K., van Rees, W. M., Li, H., Pantuso, D.,Mahadevan L.M. & Vlassak, J.J.," Poisson’s ratio and residual strain of freestanding ultra-thin films", Journal of the Mechanics and Physics of Solids,137, 103821, 2020. https://doi.org/10.1016/j.jmps.2019.103821
  2. Cuddalorepatta G. K., Li, H., Pantuso, D., & Vlassak, J.J., “Measurement of the stress-strain behavior of freestading ultra-thin films”, Materialia, (9), 100502, 2020. https://doi.org/10.1016/j.mtla.2019.100502
  3. Cuddalorepatta G. K., Sim G.D., Li H., Pantuso D., Vlassak J. J., “Residual stress-driven test technique for freestanding ultrathin films: elastic behavior and residual strain.” J. Mater. Res. 34 (20), 3474–3482, 2019.  https://doi.org/10.1557/jmr.2019.278
  4. Gregoire J.M., Xiao K., McCluskey P.J., Dale D., Cuddalorepatta G., Vlassak,J.J. “In-situ x-ray diffraction combined with scanning AC nanocalorimetry applied to a Fe 0.84 Ni 0.16 thin-film sample”, Applied Physics Letters, 102 (20), 2013
  5. Cuddalorepatta G., Dasgupta A., “Multi-scale modeling of the viscoplastic response of as-fabricated microscale Pb-free Sn3.0Ag0.5Cu solder interconnects”, Acta Materialia, 58(18), 2010
  6. Cuddalorepatta G., Williams M., Dasgupta, A., “Viscoplastic creep response and microstructure of as-fabricated microscale Sn-3.0Ag-0.5Cu Solder Interconnects”, Journal of Electronic Materials, 39(10), 2010
  7. Cuddalorepatta G., Dasgupta A., Sealing S., Moyer J., Tolliver, T., Loman, J., “Durability of Pb-free solder between copper interconnect and silicon in photovoltaic cells”, Progress in Photovoltaics: Research and Applications, 18, 2010

Selected Refereed Conference Proceedings

  1. Cuddalorepatta, G., Dasgupta, A., " Effect of Cyclic Damage on the Constitutive Properties and Microstructure of Pb-free SAC305 Solder" MRS Spring Meeting, April 2009, San Franscisco, CA
  2. Holdermann, K, Cuddalorepatta, G., Dasgupta, A., “Dynamic Recrystallization of Sn3.0Ag0.5Cu Pb-Free Solder Alloy”, November 2008, ASME IMECE Conference, Boston, MA
  3. Cuddalorepatta, G., Dasgupta, A., “Optimization of Dwell Time for Accelerated Thermal Cycling of Sn3.0Ag0.5Cu Pb-Free Interconnects”, July 2008, IISc Centenary- International Conference on Advances in Mechanical Engineering (IC-ICAME), Bangalore, India.
  4. Cuddalorepatta, G., Dasgupta, A., “Effect of Primary Creep Behavior on Fatigue Damage Accumulation Rates in Accelerated Thermal Cycling of Sn3.0Ag0.5Cu Pb-Free Interconnects”, 2008, EuroSiME Conference, Germany
  5. Cuddalorepatta, G., Herkommer, D., Dasgupta, A., “Stress Relaxation Characterization of Hypoeutectic Sn3.0Ag0.5Cu Solder – Experiment and Modeling”, April 2007, EuroSiME Conference, London, UK
  6. Cuddalorepatta, G., Dasgupta, A., Sealing, S., Moyer, J., Tolliver, T., and Loman, J., “Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells – Experiment and Modeling”, May 2006, ITHERM Conference, San Diego, CA
  7. Cuddalorepatta G., Dasgupta A., “Cyclic Mechanical Durability Of Sn3.0Ag0.5Cu Pb-Free Solder Alloy”, November 2005, ASME IMECE Conference, Orlando, FL
  8. Cuddalorepatta, G., Pitarresi, J., Sammakia, B., “Mechanical Modeling of Liquid Crystal on Silicon (LCoS) Microdisplay” June 2004, ASME IMECE Conference, Las Vegas, NV

PRESENTATIONS

Invited Talks and Selected Conference Presentations

2016 Characterization of the mechanical behavior of freestanding ultra thin films. Society of Engineering Science 53rd Annual Technical Meeting, College Park, MD (Invited Talk)

2016 Elastic behavior of freestanding ultra thin films. ASME-IMECE Conference, Phoenix, AZ. (Conference presentation)

2007 Constitutive behavior and fatigue behavior of microscale Pb-free SnAgCu solder. Department of Aerospace Engineering, Indian Institute of Science, Bangalore, India (Invited Talk)