Vapor Deposition of Highly Conformal Copper Seed Layers for Plating through-Silicon Vias (TSVs) Tuesday, October 11, 2011: ecs_meeting_2011.pdf ECS Meeting, Fall 2011 Boston, MA
ALD and CVD of Copper-Based Metallization for Microelectronic Fabrication Monday, June 27, 2011: ald_meeting_2011.pdf ALD Meeting, Summer 2011 Cambridge, MA
Bottom-up Filling of Surfactant-catalyzed CVD of Copper and Copper-manganese Alloy in Narrow Trenches Tuesday, April 26, 2011: mrs_spring_2011.pdf MRS Meeting, Spring 2011 San Francisco, CA
Selective Chemical Vapor Deposition (CVD) of Manganese Self-‐aligned Adhesion and Barrier Layers for Cu Interconnections in Microelectronics Tuesday, April 6, 2010: mrs_spring_2010.pdf MRS Meeting, Spring 2010 San Francisco, CA